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    Home > Product Lines > Glass materials
    Sealing glass for low temperature type, laser sealing glass(FPD, OLED, DSSC)
    - It is used as OLED Sealing by protecting the organic device from dust and moisture, as well as excellent adhesion.
    - It is able to be sintered even in low temperature, so applicable to display sealing materials as well as OLED Seal.
     
    OLED (organic light-emitting diode) structure
    DSSC (Dye-sensitized solar cell) structure
      Thermal property (℃)        
    Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
    Bi2O3-ZnO-B2O3 350-400 400-450 70-90 1.5-2.5 Yellow OLED, DSSC, etc
    B2O3-ZnO-BaO 450-500 480-550 70-90 1.5-2.5 White DSSC, etc
    V2O5-TeO2-BaO 450-500 350-400 60-90 1.5-2.5 Black OLED, etc
    Glass materials for solar cell electrode pastes
    - It is used for solar cell electrode pastes, showing excellent electrical properties and efficiencies.
    - It prevents occurs of bending by good matching with any wafer.
     
      Thermal property (℃)        
    Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
    PbO-SiO2-Al2O3 350-400 400-450 70-90 1.5-2.5 White Front-Ag paste, Back-Ag paste, Back-Al paste
    PbO-SiO2-ZnO 350-400 400-450 70-100 1.5-2.5 White Front-Ag paste, Back-Ag paste, Back-Al paste
    Bi2O3-ZnO-B2O3 350-400 400-450 70-90 1.5-2.5 Brown Front-Ag paste, Back-Ag paste, Back-Al paste
    Bi2O3-SiO2-CuO 480-530 520-560 70-90 1.5-2.5 Brown Front-Ag paste, Back-Ag paste, Back-Al paste
    SiO2-V2O5-B2O3 380-430 400-450 70-90 1.5-2.5 Brown Front-Ag paste, Back-Ag paste, Back-Al paste
    B2O3-ZnO-BaO 450-500 480-550 70-90 1.5-2.5 White Front-Ag paste, Back-Ag paste, Back-Al paste
    Electronic components (LTCC, MLCC, Overglazed, etc)
    - DAEJOO'S glass powders and glass pastes are used for chip components.
    - They are used as body of chip components like LTCC, MLCC. Also used as overglaze in chip resistor.
    - They are showing the excellent properties of dielectric, resistance, chemically-resistant.
    - DAEJOO is retaining a variety types of glass materials.
    Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
    BaO-ZnO-B2O3 450-500 500-550 70-100 2.0-3.0 White Resistance, Electrode
    SIo2-BaO-B2O3 630-690 680-730 70-100 2.0-3.0 White Overglazing
    Bi2O3-ZnO-B2O3 350-400 400-450 70-90 1.5-2.5 Yellow Resistance, Electrode
    Bi2O3-SiO2-CuO 480-530 520-560 70-90 1.5-2.5 Yellow Resistance, Electrode
    SiO2-B2O3-Li2O 500-550 55-600 70-90 1.0 -1.5 White Resistance, Electrode
    Glass materials for LED applilcations(Encapsulation)
    - It is glass frit for LED applications, processed in low temperature.
    - It shows high transparency, high density, and high reflexibility.
     
     
      Thermal property (℃)        
    Glass type Tg Tdsp CTE (x10-7) Glass powder Size (D50) Color Application
    SiO2-B2O3-ZnO 500-550 550-600 70-90 5.0-20.0 White LED (for Encapsulation)
    SiO2-B2O3-ZnO-BaO 450-500 500-550 70-100 5.0-20.0 White LED (for Encapsulation)
    * Tg - glass Transition temperature
    * Glass Transition temperature - Dilatometric softening point
    * CTE - Coefficient of Thermal Expansion
    * CTE - Temp range - 50-350℃
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